Intel 400GB, P3700, PCI-Express 3.0, 20nm, MLC, 933079

Intel® SSD DC P3700 Series (400GB, 2.5in PCIe 3.0, 20nm, MLC)

• Capacity: 400GB
• Components
– Intel® 20nm MLC NAND Flash Memory
• Form Factors
– 2.5-inch Form Factor
  15mm Z-height
  8639-compatible connector
– AIC Form Factor
  Half-height, Half-length
  Single slot x4 connector
• PCIe* Gen3 X4
• Performance1,2
– Seq R/W: Up to 2800/2000MB/s3
– IOPS Rnd 4KB4 70/30 R/W: Up to 265K
– IOPS Rnd 4KB4 R/W: Up to 460/175K
– Seq Latency (typ) R/W: 20/20µs
• Operating System Support:
– Windows* Server 2012 R2, 2012,
2008 R2 x64
– Windows* 7, Windows* 8, Windows* 8.1
(32/64bit)
– RHEL* 6.5, 7.0
– SLES11 SP3*
– UEFI 2.3.1*
• Reliability
– Uncorrectable Bit Error Rate (UBER):
1 sector per 10
17 bits read
– Mean Time Before Failure (MTBF):
2 million hours
– T10 DIF protection
– Variable Sector Size: 512, 520, 528, 4096,
4104, 4160, 4224 Bytes
• Compliance
– NVM Express* 1.0
– PCI Express* Base Specification Rev 3.0
– Enterprise SSD Form Factor Version 1.0a
– PCI Express Card Electro-Mechanical (CEM)
Specification Rev 2.0
• Certifications and Declarations
– UL*, CE*, C-Tick*, BSMI*, KCC*, Microsoft*
WHQL*, VCCI*
• Power
– 2.5-inch: 3.3V and 12V Supply Rail
– AIC: 3.3V and 12V Supply Rail
– Enhanced power-loss data protection
– Active/Idle (TYP): Up to 25W/4W (TYP)
• Endurance Rating
– Up to 36.5 PBW (Petabytes Written)5
10 Drive Writes/day (JESD219 workload)
• Temperature Specification
– Operating:
  AIC: 0 to 55° C ambient with
specified airflow
  2.5-inch: 0 to 35° C ambient,
0 to 70° C case with specified airflow
– Non-Operating6
: -55 to 95° C
– Temperature monitoring (In-band and by
way of SMBUS)
– Thermal throttling
• Weight
– AIC: 400/800GB up to 185gm
1.6TB, 2TB up to 195gm
– 2.5-inch: 400/800GB up to 115gm
1.6TB, 2TB up to 125gm
• Shock
– 2.5-inch: 1,000 G/0.5msec
– AIC: 50 G Trapezoidal, 170 in/s
• Vibration
– Operating: 2.17 GRMS (5-700Hz)
– Non-Operating: 3.13 GRMS (5-800Hz)
• Product Ecological Compliance
– RoHS